Hardware System Engineer, Principal
Qualcomm
- San Diego, CA
- Permanent
- Full-time
Packaging EngineeringGeneral Summary:As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. We are seeking a talented and motivated Hardware System engineer with focus in package/system architecture, design and advanced technologies. This role will focus on future system design architectures across all Qualcomm business units and how design and technology changes will shape the future roadmap.Responsibilities:
- Lead advanced system architecture and design exploration projects focusing on 3-5yr+ disruptive technologies supporting all BU product needs
- Coordinate competitive analysis across hardware systems team to give a comprehensive view supporting each BU and focused technology areas (package design, interfaces, components, technology, etc...)
- Drive system design requirements for advanced technology integration test platforms/chips to ensure Qualcomm is leading and ready to jump to the next revolutionary technologies
- Master’s degree / PhD in Science, Engineering, or related field.
- 7-10+ years of professional experience in package design, system architecture and advanced package/system technologies
- In depth experience on advanced package/system technologies such as 2.5D, 3D, embedded components, and other advanced integration technologies
- Experience with chip-to-chip (C2C) and die-to-die system interface architecture and design
- Experience with high bandwidth memory system architecture and technology integration
- Experience with chiplet system architecture and technology integration
- Bachelor's degree in Science, Engineering, or related field and 5+ years of package design, system architecture and advanced package/system technologies.
- 5yr+ years of professional experience in package design, system architecture and advanced package/system technologies