Staff Product Package Engineer
Qorvo
- Greensboro, NC
- Permanent
- Full-time
- Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions.
- Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
- Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and/or problem solving.
- Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing.
- Develop and deploy advanced design rules into next generation products.
- Thorough industry knowledge and experience of packaging technologies.
- Strong background in process / packaging technologies preferably with direct experience in either RF Modules or high power and high frequency packages.
- Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminate, etc.
- Strong understanding of Design for Manufacturability and requirements needed to ramp these technologies in a high volume manufacturing environment
- Proven track record of supporting New Product and/or Technology through innovative packaging solutions.
- Ability to utilize SPC techniques, DOE, and structured problem solving methodologies (e.g. DMAIC, 8D).
- Experience with Program Management Methodology
- 7-10 years' direct experience in semiconductor packaging.
- BS, or higher in Engineering or Material science.