Senior NPI Manager

• Develop and drive package roadmap.
• Initiate new process engineering and material development to strengthen the Company product and packaging roadmap.
• Design new packaging methodologies to meet business/customer requirements.
• Responsible for design for manufacturing (DFM) for the success of customer products.
• Support critical customer issues, including investigation, experiment, simulations, etc.
• Research the packaging materials, responsible for characterization, application, and selection.
• Develop the equipment technology along with the package roadmap.
• Other duties as assigned by supervisor.

• Bachelor Degree or above in electrical, mechanical, thermal engineering or equivalent.
• Excellent oral and written skills in English.
• More than 10- 15 years work experience including 5~8 years semiconductor industry experience.
• Good knowledge of NPI product development (APQP).
• Wafer process and semiconductor knowledge.
• Effective management, communication, and leadership skills.
• Strategic execution and planning skills.
• Professional in process control methodology, 6 sigma, DMAIC, 8D and international quality standard

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