Sr. Hardware Mechanical Engineer

NAPS

Tijuana, B.C.
Permanente
Tiempo completo

Hace 20 días

DescripciónIn order to drive our next phase of growth in cellular, wireless peripherals and 4G/5G, we are expanding the system test and correlation group. The system level test group is responsible for characterizing system performance for Qualcomm leading-edge Snapdragon products in the most advanced processes. In this role, the mechanical engineer is responsible for collaborating with multiple engineering teams to ensure the overall design of hardware in support of product characterization and test of semiconductor devices. Initial focus will be on RF high volume manufacturing System Level Test support hardware, interfacing printed circuit board design and socket interconnect technologies.The mechanical engineer is expected to play a key role in designing hardware and be able to evaluate the hardware aspects of the overall design from the perspective of how the designs will function within the test platform ecosystem. Some example tasks include:

Used 3D CAD modeling software to design mechanical hardware and fixtures that support multiple automation equipment for system-level test platforms (SLT).
Conduct engineering design tolerance stack up analysis for IC test sockets
Temperature forcing systems interfacing hardware for socketed printed circuit board test applications.
Utilize Agile product lifecycle management software tools for generating engineering change orders
Coordinating offshore resources to assist in mechanical drawings and technical reviews for various hardware supporting all product test support teams.
Ability to clearly communicate and collaborate with engineering leads to capture relevant design requirements
Act as a technical leader to full fill dedicated demand for small scope projects. Coordinate project activities with other external engineering resources, vendors, and consultants.

Minimum Qualifications: * 3+ years of Mechanical Design Engineering experience

Proficiency using Creo Parametric 3D modelling tools or equivalent using top down design assembly methods.
Thorough working knowledge of critical dimensions and geometric tolerancing applications per ASME Y14.5-2009.
Experience performing tolerance analysis calculations
Ability to set up and run DOE's to trouble shoot test issues

Preferred Qualifications: * Working knowledge of FEA Methodology for test correlation

Machined, injection molded and sheet metal design experience
Knowledge of Semiconductor automated test equipment
Familiarity with Agile product lifecycle management tool

Education RequirementsBSME or equivalent required, MSME or equivalent preferred.

NAPS

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