Advanced Product Engineer(Packaging/3DIC)
Siemens - Hsinchu City - China
complex world of chip, board, and system design. Packaging/High Speed Advanced Product Engineer Hsinchu City, Taiwan... equipment manufacturers. Primary responsibility is to work with foundry partners to develop IC packaging and 3DIC...
May 31
MTS IC-Advance Packaging CAD Engineer
Advanced Micro Devices - Hsinchu City
_ THE ROLE: The candidate is an experienced Package CAD MTS Engineer that has excellent communication & project management... Layout tools such as Cadence SIP, APD 17.4, XPD, ICC2, Packaging verifications tools or Silicon Physical Layout Software...
April 16
Staff/Senior IC Packaging Engineer - Mechanical Simulation
Qualcomm - Hsinchu City
Job Description: Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group Packaging...) and Chip-Package Interaction (CPI) teams by providing mechanical simulation support for current HVM and advanced packaging...
April 13
Principal Customer Validation Engineer
Micron - Jhubei, Hsinchu County
into intelligence, inspiring the world to learn, communicate and advance faster than ever. JR48738 Principal Customer Validation... Engineer Responsibilities include, but not limited to in this role. You will work closely with Micron CXL Solutions Group...
May 15
Micron - Jhubei, Hsinchu County
into intelligence, inspiring the world to learn, communicate and advance faster than ever. JR53865 Principal Validation Engineer... Validation Engineer Responsibilities Include, But not limited to In this role, you will work closely with the firmware, software...
May 10