Advanced Micro Devices - Hsinchu City
: Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package...
March 7
Advanced Micro Devices - Hsinchu City
package Manufacturing readiness for New Product bring up at manufacturing site. Responsible for packaging yield, quality... and continuous improvement. Responsible for the packaging interaction activities among assembly, bump, 3D IC, HBM and wafer fab...
February 12
Advanced Micro Devices - Hsinchu City
_ THE ROLE: A design engineer who has experiences on substrate layout design, ballmap assignment, high speed interface...
February 12
MTS - Packaging Application Engineering
GlobalFoundries - Hsinchu City
an experienced Package (SiPh) Applications Engineer. You will be responsible for the preparation of the quotes in response... to customer requests in various packaging formats. The selected individual will assemble and lead team to address all package...
February 19
Qualcomm - Hsinchu City
’s Central Hardware systems team has an opening for a Packaging EDA Intern. This role focuses on developing and automating tools...
March 1