Qualcomm - Hsinchu City
Job Description: Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group Packaging... IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible...
April 20
Advanced Micro Devices - Hsinchu City
_ SMTS PACKAGING ENGINEER THE ROLE: Candidate is required to work closely with oSATs and cross-functional teams to bring... site. Responsible for packaging yield, quality, cost and operation productivity improvements and sustaining activities...
April 16
Advanced Micro Devices - Hsinchu City
EXPERIENCE: Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing...
March 26
Advanced Micro Devices - Hsinchu City
: Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package...
March 7
Qualcomm - Hsinchu City
’s Central Hardware systems team has an opening for a Packaging EDA Intern. This role focuses on developing and automating tools...
March 1