Advanced Product Engineer(Packaging/3DIC)
Siemens - Hsinchu City - China
complex world of chip, board, and system design. Packaging/High Speed Advanced Product Engineer Hsinchu City, Taiwan... equipment manufacturers. Primary responsibility is to work with foundry partners to develop IC packaging and 3DIC...
May 31
Advanced Micro Devices - Hsinchu City
_ THE ROLE: AMD-AECG Si-Tech team is looking for a dynamic, competent advanced packaging engineer to join us. As a part... of AMD packaging R&D team, you will drive new technology development, collaborate with internal and external teams...
April 19
MTS IC-Advance Packaging CAD Engineer
Advanced Micro Devices - Hsinchu City
_ THE ROLE: The candidate is an experienced Package CAD MTS Engineer that has excellent communication & project management... Layout tools such as Cadence SIP, APD 17.4, XPD, ICC2, Packaging verifications tools or Silicon Physical Layout Software...
April 16
MTS IC-Advance Packaging Design Engineer
Advanced Micro Devices - Hsinchu City
_ THE ROLE: The candidate is an experienced IC Advance Package Design MTS Engineer that has excellent communication... packaging technologies (Chiplet) Well experienced in using CAD Layout tools such as Cadence SIP, APD or XPD, and other Silicon...
April 16
Staff/Senior IC Packaging Engineer - Mechanical Simulation
Qualcomm - Hsinchu City
Job Description: Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group Packaging...) and Chip-Package Interaction (CPI) teams by providing mechanical simulation support for current HVM and advanced packaging...
April 13