IC Package Layout Engineer, Up to Senior Staff
Qualcomm - Hsinchu City
package size. Minimum Qualifications As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven... configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.). Experience in package design...
April 3
Renesas Electronics - Jhubei, Hsinchu County
Job Description Design and develop package and interconnect methods for Renesas's packaging needs in the areas... of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging. Package technologies qualification...
February 22
Nvidia - Hsinchu City
We are looking for an experienced, bright, focused, analytical, and motivated manufacturing engineer... and/or manufacturing environment in the optics assembly and/or equipment management industry. Seasoned manufacturing/mechanical/Optics...
April 3
Substrate Engineer Adv Tech Dev/Senior Staff Engineer
Marvell - Hsinchu City - Jhubei, Hsinchu County
-in-a-lifetime opportunity. As the substrate engineer, you will have the opportunity to work closely with world class substrate... cutting edge package solutions in all product portfolios. What You Can Expect Drill on each substrate process to solve...
February 6
Failure Analysis Senior Staff Engineer
Marvell - Hsinchu City
Requirements: - Experience with circuit design, IC fabrication, assembly and product testing - Strong analytical and problem... in reviewing design and package layout - Proficiency in 8D Problem Solving process and tools - Strong leadership skills...
March 27