Renesas Electronics - Jhubei, Hsinchu County
Job Description Design and develop package and interconnect methods for Renesas's packaging needs in the areas... of Power SiP/modules, Power QFN, Wafer level, flip-chip, multi-chip module and power device packaging. Package technologies...
June 2
Renesas Electronics - Jhubei, Hsinchu County
and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, Power QFN, Wafer... level, flip-chip, multi-chip module and power device packaging. Package technologies qualification for consumer...
May 15
Forbes前40強_社媒龍頭美商(新竹)_Silicon Package Development Engineer
Adecco - Jhubei, Hsinchu County
analysis & pkg design software is a plus Experience with TSV process, 2.5D/3D package and Hybrid bonding... is a plus 【Job Responsibilities】 Establish relationship with foundry, OSAT, material supplier & support package development activities for multiple...
May 23
MTS IC-Advance Packaging Design Engineer
Advanced Micro Devices - Hsinchu City
_ THE ROLE: The candidate is an experienced IC Advance Package Design MTS Engineer that has excellent communication... Package design team to define tool roadmap that will meet the design objectives for performance, cost, and quality for advance...
April 16
【Welcome New Grad】System Level Test Engineer, up to Sr
Qualcomm - Hsinchu City
peripherals like DDR, UFS, USB, Display, Camera, Power management IC is preferred. Understanding of Module assembly, Boundary... scan test and assembly defects will be plus. Experience in Python, C#, .NET Framework, C/C++, Perl is a plus. Working...
May 10