Advanced Micro Devices - Hsinchu City
package Manufacturing readiness for New Product bring up at manufacturing site. Responsible for packaging yield, quality... and continuous improvement. Responsible for the packaging interaction activities among assembly, bump, 3D IC, HBM and wafer fab...
May 6
Qualcomm - Hsinchu City
Job Description: Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group Packaging...
April 20
Advanced Micro Devices - Hsinchu City
EXPERIENCE: Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing...
March 26
Advanced Micro Devices - Hsinchu City
: Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package... Strong knowledge in data analysis tools (JMP, Snowflake, Power BI…etc.) Experience on substrate, bump and assembly integration...
March 7
Qualcomm - Hsinchu City
’s Central Hardware systems team has an opening for a Packaging EDA Intern. This role focuses on developing and automating tools... design Work in collaboration with the rest of the team to ensure optimal integration inside the overall CAD platform...
March 1