Advanced Micro Devices - Hsinchu City
: Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package... and performance. Leads establishment, review and audit of manufacturing specification, control plan and FMEA for all assembly...
March 7
Advanced Micro Devices - Hsinchu City
and continuous improvement. Responsible for the packaging interaction activities among assembly, bump, 3D IC, HBM and wafer fab... process engineering with min total 7 years assembly work experience. Possess InFO, Chiplet packaging, 2.5D/3D TSV/Packaging...
February 12
Advanced Micro Devices - Hsinchu City
_ THE ROLE: A design engineer who has experiences on substrate layout design, ballmap assignment, high speed interface...
February 12
MTS - Packaging Application Engineering
GlobalFoundries - Hsinchu City
an experienced Package (SiPh) Applications Engineer. You will be responsible for the preparation of the quotes in response... to customer requests in various packaging formats. The selected individual will assemble and lead team to address all package...
February 19
Substrate Engineer Adv Tech Dev/Senior Staff Engineer
Marvell - Hsinchu City - Jhubei, Hsinchu County
, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Marvell Packaging Substrate team...-in-a-lifetime opportunity. As the substrate engineer, you will have the opportunity to work closely with world class substrate...
February 6