Qualcomm - Hsinchu City
Job Description: Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group Packaging... IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible...
April 20
Advanced Micro Devices - Hsinchu City
_ SMTS PACKAGING ENGINEER THE ROLE: Candidate is required to work closely with oSATs and cross-functional teams to bring.... Drive assembly process baseline standardization and continuous improvement. Responsible for the packaging interaction...
April 16
Advanced Micro Devices - Hsinchu City
EXPERIENCE: Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing..., Assembly manufacturing, lid & stiffener manufacturing process is an added advantage) Track record of development work leading...
March 26
Advanced Micro Devices - Hsinchu City
: Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package... and performance. Leads establishment, review and audit of manufacturing specification, control plan and FMEA for all assembly...
March 7
IC Package Layout Engineer, Up to Senior Staff
Qualcomm - Hsinchu City
Job Description: Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group Packaging... package size. Minimum Qualifications As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven...
April 3