Staff/Senior IC Packaging Engineer - Mechanical Simulation
Qualcomm - Hsinchu City
Job Description: Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group Packaging...) and Chip-Package Interaction (CPI) teams by providing mechanical simulation support for current HVM and advanced packaging...
April 13
MTS IC-Advance Packaging CAD Engineer
Advanced Micro Devices - Hsinchu City
_ THE ROLE: The candidate is an experienced Package CAD MTS Engineer that has excellent communication & project management... Layout tools such as Cadence SIP, APD 17.4, XPD, ICC2, Packaging verifications tools or Silicon Physical Layout Software...
April 16
Applications Engineering, Principal Engineer
Synopsys - Hsinchu City
Job Description and Requirements As a transistor level (SPICE) simulation products Field Applications Engineer..., you will be accountable for providing technical service to customers and be deeply involved in simulating of variety type of designs including...
May 1
SW Applications Engineer (Anchor)
KLA Corporation - Hsinchu City
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel...
June 8
Application Engineer III - (E3)
Applied Materials - Hsinchu City
the work cycle until the implementation of the solution Technically leads difficult, complex application activities... application support plans for installation Create & Lead new methodologies in order to optimized system performance for specific...
March 22