Qualcomm - Hsinchu City
Job Description: Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group Packaging... Engineering Qualcomm Overview: Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration...
April 20
Advanced Micro Devices - Hsinchu City
’ experience in InFO or 2.5D/3D Bump/TSV/Packaging or WLFO process engineering with min total 7 years assembly work experience..._ SMTS PACKAGING ENGINEER THE ROLE: Candidate is required to work closely with oSATs and cross-functional teams to bring...
April 16
Advanced Micro Devices - Hsinchu City
market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering... EXPERIENCE: Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing...
March 26
Advanced Micro Devices - Hsinchu City
: Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package... with minimum supervision ACADEMIC CREDENTIALS: Bachelor/MS degree in Engineering LOCATION: Hsinchu, Taiwan #LI-SC1...
March 7
Qualcomm - Hsinchu City
’s Central Hardware systems team has an opening for a Packaging EDA Intern. This role focuses on developing and automating tools..., Synopsys, Ansys, Siemens, etc. Preferred Qualifications: Candidate pursuing MS Electrical Engineering/Computer Science...
March 1