Renesas Electronics - Jhubei, Hsinchu County
Job Description Design and develop package and interconnect methods for Renesas's packaging needs in the areas... of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging. Package technologies qualification...
February 22
Advanced Micro Devices - Hsinchu City
: Drive IC packaging initiatives from product qualification to high volume ramp for next generation FCBGA & Advance Package... manufacturing and product quality excursion to safeguard product quality. Research and develop solutions to enhance package...
March 7
Summer Intern- PKG SI/PI Engineer
Qualcomm - Hsinchu City
with package and IC designers to find ways to optimize the overall package design. The candidate’s responsibility is working... Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work...
March 1
Advanced Micro Devices - Hsinchu City
experience in IC package technology and product development in the semiconductor industry with consistent track record..._ THE ROLE: Package design and SI/PI and PDN topology assessment for advanced packages in AMD AECG package design...
February 28
SIPI Engineer, Senior to Staff level
Qualcomm - Hsinchu City
with package and IC designers to find ways to optimize the overall package design. The candidate’s responsibility is working... Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work...
February 16