Intern 2025 - Package (DDQA) Development and Design Quality Assurance Engineer
Micron - Taichung City
in Global Quality Package (DDQA) Development and Design Quality Assurance team, you will involve assisting in NUDD (New Unique... during technology development phase. Work on database to ensure timely update for NUDD and package QRITS (Quality and Reliability Risk...
March 8
Advance Package Integration Engineer
Micron - Taichung City
HBM4 package integration engineer and located in Taichung. As a HBM package integration engineer you will be part of the PI... group responsible for driving development and introduction of new process solutions to the HBM (high bandwidth memory...
April 12
Package Manufacture Engineer, up to Staff (Taichung or Kaohsiung )
Qualcomm - Taichung City
Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical... across a matrix organization in a very dynamic and fast-paced environment. - Support development of products and advanced...
April 12
SR ENGINEER, PACKAGE PRE STACKING
Micron - Taichung City
into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Advanced package... technology (HBM product) research and development, experience with wafer thin wafer dicing techniques such as laser grooving...
April 19
Senior Engineer, HIG HBM Package PE
Micron - Taichung City
member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the... Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging...
April 12