MTS IC-Advance Packaging Design Engineer
Advanced Micro Devices - Hsinchu City
_ THE ROLE: The candidate is an experienced IC Advance Package Design MTS Engineer that has excellent communication... package design. Support substrate design, advance package design and test vehicles for product design roadmap and feasibility...
April 16
Staff/Senior IC Packaging Engineer - Mechanical Simulation
Qualcomm - Hsinchu City
microelectronic packaging industry. Experience with the fundamentals of IC electronic packaging structures, assembly processes...Job Description: Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group Packaging...
April 13
Advanced Micro Devices - Hsinchu City
_ THE ROLE As part of the AMD's Advanced Packaging team, you will drive technology development and the Supply Chain... and reliability improvement. Interface closely with AMD’s Assembly and material partners, to develop and productize in bring up...
April 9
【Welcome New Grad】System Level Test Engineer, up to Sr
Qualcomm - Hsinchu City
scan test and assembly defects will be plus. Experience in Python, C#, .NET Framework, C/C++, Perl is a plus. Working... efficient SoCs to deliver a comprehensive, cost and energy efficient systems solution. To Test and Productized SoC with highest...
May 10
System Level Test Engineer, Staff
Qualcomm - Hsinchu City
scan test and assembly defects will be plus. Experience in Python, C#, .NET Framework, C/C++, Perl is a plus. Working... efficient SoCs to deliver a comprehensive, cost and energy efficient systems solution. To Test and Productized SoC with highest...
April 23